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XPS 300 W — High-Adhesion Structural Thermal Insulation

XPS 300 W — High-Adhesion Structural Thermal Insulation

Use XPS 300 W on accessible roofs or podium decks where load-bearing performance and maximum adhesion for membranes or coatings are critical.

Compressive strength, kPa:: 200–300

Declared thermal conductivity λD, W/(m·K):: 0,034–0,035

Reaction to fire, class:: E

Board size (length × width), mm:: 1250 × 600

Nominal thickness, mm:: 20–150

Surface type:: Waffled

Edge type:: Straight edge (I) / L-shaped edge (L)

Product standard:: EN 13164:2012+A1:2015

PNP XPS 300 W is a waffled-surface extruded polystyrene board engineered for superior adhesion of plaster and adhesive compounds, delivering a compressive strength of ≥ 300 kPa in thicknesses above 30 mm. Ideal for demanding thermal insulation applications on both horizontal and vertical building elements where a high-bond substrate surface and structural load-bearing capacity are essential.

Description

PNP XPS 300 W is a high-performance thermal insulation material (latest generation XPS) manufactured from general-purpose polystyrene. The board's waffled surface texture provides the mechanical key required for reliable adhesion of plaster and adhesive compounds. It is available in standard thicknesses from 20 to 150 mm (XPS 300 W) and in a thick-board variant, XPS 300 W TB, covering 100 to 200 mm, with declared thermal conductivity values of 0.034–0.035 W/m·K depending on thickness. Both variants comply with EN 13164:2012+A1:2015 and offer a compressive strength of ≥ 300 kPa (CS(10\Y) 300) for thicknesses above 30 mm.

Applications

Thermal insulation of exterior and interior walls (vertical elements)
Floor insulation beneath screeds or adhesive-bonded finishes
Horizontal building elements requiring a high-bond substrate surface
Façade systems where plaster or adhesive compounds are applied directly to the board surface
Heavy-duty structural applications demanding compressive strength of ≥ 300 kPa
Industrial and civil construction projects requiring consistent long-term thermal performance

Advantages

Waffled surface ensures strong mechanical adhesion of plaster and adhesive compounds
Consistently low declared thermal conductivity (0.034–0.035 W/m·K across all thicknesses)
High compressive strength at ≥ 300 kPa (CS(10\Y) 300) for thicknesses above 30 mm
Virtually zero water absorption — long-term immersion ≤ 0.7 Vol.-% and diffusion ≤ 3.0 Vol.-%
Absolute biostability and proven durability across an operating temperature range of −70 °C to +75 °C
REACH-compliant: contains no SVHC substances and manufactured without ozone-depleting blowing agents

XPS 300 W — High-Adhesion Structural Thermal Insulation — Technical
Property	Thickness range / condition	Declared value
Compressive strength / compressive stress at 10% deformation, CS(10\Y)	20–30 mm	CS(10\Y)200 (≥200 kPa)
Compressive strength / compressive stress at 10% deformation, CS(10\Y)	>30 mm	CS(10\Y)300 (≥300 kPa)
Reaction to fire, class		E
Declared thermal conductivity λD, W/(m·K)	20–100 mm	0,034
Declared thermal conductivity λD, W/(m·K)	120–150 mm	0,035
Long-term water absorption by total immersion, WL(T)		WL(T)0,7 (≤0,7 [Vol.-%])
Long-term water absorption by diffusion, WD(V)		WD(V)3 (≤3,0 [Vol-%])
Dimensional stability under specified conditions, DS		DS(70,90)
Compressive creep, CC	>30 mm	CC(2/1,5/50)130
Tensile strength perpendicular to faces, TR		TR 400
Freeze–thaw resistance, FTCD		FTCD1 (≤1 [Vol-%])
Deformation under specified compressive load and temperature conditions		DLT(2)5
Thickness tolerance, class		T1
Operating temperature, °C		−70 … +75 °C
Surface type		Waffled
Edge type		L-edge
Product standard		EN 13164:2012+A1:2015

Values according to the current technical data sheet.

XPS 300 W — High-Adhesion Structural Thermal Insulation — Packaging
Nominal thickness, mm	Declared thermal resistance RD, m²·K/W	Boards per pack, pcs	Pack area, m²	Pack volume, m³
20	0,55	20	15,00	0,3000
30	0,85	13	9,75	0,2925
40	1,15	10	7,50	0,3000
50	1,45	8	6,00	0,3000
60	1,75	6	4,50	0,2700
80	2,35	5	3,75	0,3000
100	2,90	4	3,00	0,3000
120	3,40	3	2,25	0,2700
150	4,25	2	1,50	0,2250

Transport dimensions for boards with L-edge: 615 × 1265 mm.

XPS 300 W — High-Adhesion Structural Thermal Insulation

Technical data sheet

pnp_xps300W-300WTB_600x1250_techcard_en(20.07.2026).pdf

PDF · EN

XPS 300 W — High-Adhesion Structural Thermal Insulation

Declaration of Performance

DoP PNP XPS 300 W EMI_en (U).pdf

PDF · EN

XPS 300 W — High-Adhesion Structural Thermal Insulation: is it the right board?

When to use it

You are insulating an exterior facade wall in an ETICS or direct-render system where plaster or adhesive compounds will be applied directly to the insulation face, and the substrate must bear loads ≥ 300 kPa (for boards > 30 mm).
You are insulating a floor slab, screed build-up, or underfloor heating assembly that requires both high compressive strength (≥ 300 kPa) and a surface that bonds reliably to adhesive-bonded finishes or membranes.
You are insulating a flat roof, accessible terrace, or podium deck where waterproofing membranes or coatings are bonded directly to the insulation surface and compressive loads from foot traffic or light equipment apply.
You are insulating basement perimeter walls or plinth areas where a render or protective coat will be applied directly and the soil or fill exerts moderate structural loads on the board.
You need fire class E performance (better than class F) alongside waffled-surface adhesion in a single board, for example in facade or roof assemblies subject to national fire regulations requiring at least Euroclass E.
You are specifying an inverted or green roof where the insulation layer must carry drainage layers and growing medium loads while remaining bondable to root barriers or separation membranes.
You need the Euroclass E fire classification and compressive creep resistance CC(2/1,5/50)130 (boards > 30 mm) in a bonded facade or floor system designed for 50-year service life.

When not to use it

The application requires no bonded finish coat and adhesion is irrelevant — the waffled surface adds no value and a smooth board is simpler to specify.
Compressive loads exceed 300 kPa — XPS 300 W is rated CS(10\Y) 300 (≥ 300 kPa for boards > 30 mm), which is insufficient for industrial floors, heavy parking decks, or road construction subject to 400–700 kPa demands.
You need a milled-and-grooved surface for maximum mechanical keying depth in high-build render or tile-adhesive systems — the waffled surface of XPS 300 W provides adhesion but is not a milled and grooved profile.
The design calls for factory-tapered boards to create a drainage fall on a flat roof — XPS 300 W is a uniform-thickness board and cannot form a slope in a single layer.
The application is a lightweight non-load-bearing cavity or partition where 300 kPa compressive strength is unnecessarily high and the additional cost over lower-grade boards is unjustified.

Choose instead

No bonded finish needed, smooth substrate preferred → XPS 300 (same 300 kPa strength, smooth surface, lower complexity).
Compressive loads > 300 kPa (industrial floors, heavy parking decks) → XPS 500 (500 kPa) or XPS 700 (700 kPa).
Maximum mechanical keying depth required for high-build render or tile-adhesive systems → XPS 300 MG (milled and grooved surface, 300 kPa).
Flat roof or terrace requiring a built-in drainage fall → XPS 300 SLOPE (factory-tapered, 300 kPa).
Non-load-bearing cavity, partition or lightweight application → XPS 150 W X-Grip (150 kPa, waffled surface) for bonded systems, or XPS 150 for non-bonded details.

Why XPS 300 W combines structural load capacity with a bondable surface

XPS 300 W is the product for situations where two requirements coincide: the insulation layer must carry significant structural loads, and a subsequent layer — plaster, render, tile adhesive, waterproofing membrane, or protective coating — must adhere reliably to its face. For boards thicker than 30 mm, the declared compressive strength is CS(10\Y) 300 (≥ 300 kPa), and the compressive creep class is CC(2/1,5/50)130, confirming long-term resistance to sustained load. The 20–30 mm range is rated CS(10\Y) 200 (≥ 200 kPa); consult the current TDS and a qualified designer to confirm suitability for thin-board applications under load.

The waffled surface — the defining feature of all PNP "W" boards — creates a regular pattern of raised and recessed areas across both faces. This geometry provides the mechanical key that plaster and adhesive compounds need to grip the XPS without relying solely on chemical adhesion to the smooth extrusion skin. The result is relevant in ETICS facade systems, floor assemblies with adhesive-bonded finishes, and inverted or accessible roofs where membranes are bonded rather than mechanically fastened. For a direct comparison with the smooth-surface sibling, see XPS 300 vs XPS 300 W — Smooth or Waffled Surface?

Thermally, XPS 300 W performs identically to XPS 300: λD = 0.034 W/(m·K) for thicknesses of 20–100 mm and 0.035 W/(m·K) for 120–150 mm, both per EN 13164:2012+A1:2015. Long-term water absorption by total immersion is WL(T)0.7 (≤ 0.7 Vol.-%), making the board suitable for permanently damp environments such as buried perimeter walls, inverted roofs, and ground-contact floors. Fire classification is Euroclass E — one class better than the Euroclass F of the 150-grade boards — which supports its use in assemblies where national regulations set a minimum fire performance threshold.

Where compressive loads exceed 300 kPa, or where a milled-and-grooved surface is specified for deeper mechanical keying, XPS 300 W is not the correct choice: see the product selection guide at Which PNP XPS Should I Choose? and confirm load and adhesion requirements with a qualified structural engineer or facade specialist before finalising the specification.

XPS 300 W — High-Adhesion Structural Thermal Insulation — frequently asked questions

What is the compressive strength of XPS 300 W, and does it vary with thickness?

For boards thicker than 30 mm, XPS 300 W is rated CS(10\Y) 300 (≥ 300 kPa at 10 % deformation or yield, per EN 826). For 20–30 mm boards the rating is CS(10\Y) 200 (≥ 200 kPa). Confirm that the rated strength is appropriate for your specific load case with a qualified designer; see the current TDS for full details.

How does the waffled surface of XPS 300 W differ from the milled-and-grooved surface of XPS 300 MG?

The waffled surface ("W") is an embossed pattern formed during extrusion that creates a regular waffle-like texture on both faces, providing mechanical key for plasters, adhesives, and coatings. The milled-and-grooved surface ("MG") is machined after extrusion to produce a rougher profile with deeper grooves intended specifically to maximise keying depth for high-build render and tile-adhesive systems. The right choice depends on the render or adhesive system specified; consult the system manufacturer's requirements.

Can XPS 300 W be used in an inverted (upside-down) flat-roof assembly?

The solutions catalogue lists XPS boards in vehicle-accessed inverted roofing and green-roof assemblies. XPS 300 W has WL(T)0.7 (≤ 0.7 Vol.-%) long-term water absorption by immersion and CC(2/1,5/50)130 creep resistance (boards > 30 mm), which supports use in inverted roof configurations. Whether 300 kPa is sufficient for the specific load combination — including drainage layers, ballast, and imposed loads — requires verification by a qualified structural engineer and reference to the current TDS and DoP.

What fire class does XPS 300 W carry, and is it sufficient for facades?

XPS 300 W is classified Euroclass E per EN 13164:2012+A1:2015. Whether Euroclass E satisfies the fire requirements of a particular facade system depends on national building regulations, the overall system classification, and the jurisdiction; a fire engineer or the ETICS system certificate holder should confirm compliance for each project.

Is XPS 300 W suitable for ETICS (external insulation composite system) facades?

The waffled surface of XPS 300 W is designed to provide mechanical key for adhesive compounds and base-coat renders, and the solutions catalogue includes waffled-surface boards in ETICS plaster and clinker-tile facade systems. System-level compliance — including board fixing, base coat, mesh, and finish — must be confirmed against the specific ETICS system holder's specifications and any relevant European Technical Assessment (ETA) or national approval.

What is the declared thermal conductivity of XPS 300 W?

λD = 0.034 W/(m·K) for thicknesses of 20–100 mm, and λD = 0.035 W/(m·K) for thicknesses of 120–150 mm, both declared per EN 13164:2012+A1:2015. These values are the same as the smooth-surface XPS 300.

When should I choose XPS 500 or XPS 700 instead of XPS 300 W?

If the design compressive load exceeds 300 kPa — for example in industrial floor slabs, heavy parking structures, or road construction — XPS 300 W's CS(10\Y) 300 rating is insufficient. In those cases, <a href="/products/xps-500/">XPS 500</a> (500 kPa) or <a href="/products/xps-700/">XPS 700</a> (700 kPa) should be evaluated. Establishing the actual design load is an engineering task; consult a qualified structural engineer and refer to the TDS and DoP for each grade.

Does XPS 300 W come in a thick-board (TB) format for thicknesses above 150 mm?

The product description references an XPS 300 W TB variant covering 100–200 mm; thicknesses above 200 mm are noted as available on request. Confirm current availability and technical data for TB thicknesses by contacting PNP XPS at sales@pnpinsulation.com or referring to the current TDS.

XPS 300 W — High-Adhesion Structural Thermal Insulation

Description

Applications

Advantages

Technical data sheet

Declaration of Performance

XPS 300 W — High-Adhesion Structural Thermal Insulation: is it the right board?

When to use it

When not to use it

Choose instead

Why XPS 300 W combines structural load capacity with a bondable surface

XPS 300 W — High-Adhesion Structural Thermal Insulation — frequently asked questions

See also

XPS 300 — Structural Foundation & Flooring Thermal Insulation

XPS 500 — Industrial & High Compression Thermal Insulation

XPS 300 SLOPE — Tapered Roof Drainage Thermal Insulation

XPS 700 — Extreme Loads & Civil Engineering Thermal Insulation

XPS 150 X-Grip — Superior Adhesion, Lightweight Thermal Insulation

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