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Product catalogue

Which PNP XPS Should I Choose? Application Guide — PNP XPS produces boards from 150 kPa to 700 kPa compressive strength, in smooth, waffled (W), and factory-tapered (SLOPE) surface variants; the right choice depends on three factors: the mechanical load the board must carry, whether a render or adhesive layer is bonded directly to the face, and whether a built-in drainage fall is needed. Match your application to the decision table below, then verify thickness and thermal resistance with the relevant TDS and a qualified designer.

XPS 300 — Structural Foundation & Flooring Thermal Insulation

Smooth · 300 kPa

XPS 300 — Structural Foundation & Flooring Thermal Insulation

Use XPS 300 where heavy loads demand reliable thermal insulation, including foundations, floor slabs, and accessible roofs.

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XPS 300 W — High-Adhesion Structural Thermal Insulation

W (Waffle) · 300 kPa

XPS 300 W — High-Adhesion Structural Thermal Insulation

Use XPS 300 W on accessible roofs or podium decks where load-bearing performance and maximum adhesion for membranes or coatings are critical.

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XPS 500 — Industrial & High Compression Thermal Insulation

Smooth · 500 kPa

XPS 500 — Industrial & High Compression Thermal Insulation

Use XPS 500 where heavy static and dynamic loads demand maximum compression resistance, including industrial floors, parking decks, and road construction.

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XPS 300 SLOPE — Tapered Roof Drainage Thermal Insulation

Slope · 300 kPa

XPS 300 SLOPE — Tapered Roof Drainage Thermal Insulation

Use XPS 300 SLOPE on flat roofs, terraces and green roofs where a single-layer solution must create drainage fall and provide lasting thermal insulation.

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XPS 700 — Extreme Loads & Civil Engineering Thermal Insulation

Smooth · 700 kPa

XPS 700 — Extreme Loads & Civil Engineering Thermal Insulation

Use XPS 700 where maximum compressive strength is critical, including heavy civil infrastructure, industrial foundations, and high-load road construction projects.

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XPS 150 X-Grip — Superior Adhesion, Lightweight Thermal Insulation

X-Grip · 150 kPa

XPS 150 X-Grip — Superior Adhesion, Lightweight Thermal Insulation

PNP XPS 150 X-Grip is a waffled-surface extruded polystyrene board engineered for superior adhesion of renders, tile adhesives and bonded ETICS systems — about 17 % lower carbon footprint than PNP XPS 300 W, lighter to handle.

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Compare the products at a glance

Compare the products at a glance
ProductCompressive strength, kPaDeclared thermal conductivity λD, W/(m·K)Reaction to fire, classNominal thickness, mmSurface typeEdge type
XPS 300 — Structural Foundation & Flooring Thermal Insulation200–3000,034–0,035E20–150SmoothStraight edge (I) / L-shaped edge (L)
XPS 300 W — High-Adhesion Structural Thermal Insulation200–3000,034–0,035E20–150WaffledStraight edge (I) / L-shaped edge (L)
XPS 500 — Industrial & High Compression Thermal Insulation5000,034–0,035E40–120SmoothStraight edge (I) / L-shaped edge (L)
XPS 300 SLOPE — Tapered Roof Drainage Thermal Insulation300—————
XPS 700 — Extreme Loads & Civil Engineering Thermal Insulation7000,034–0,035E20–150SmoothStraight edge (I) / L-shaped edge (L)
XPS 150 X-Grip — Superior Adhesion, Lightweight Thermal Insulation1500,033E40–100WaffledStraight edge (I) / L-shaped edge (L)

Values according to the current technical data sheet.

Contacts

PNP Orange Kft.

Address:  8100, Várpalota, Fehérvári út 28-14., Hungary

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