XPS 300 — Structural Foundation & Flooring Thermal Insulation
Smooth · 300 kPa

Use XPS 300 where heavy loads demand reliable thermal insulation, including foundations, floor slabs, and accessible roofs.
More detailsWhich PNP XPS Should I Choose? Application Guide — PNP XPS produces boards from 150 kPa to 700 kPa compressive strength, in smooth, waffled (W), and factory-tapered (SLOPE) surface variants; the right choice depends on three factors: the mechanical load the board must carry, whether a render or adhesive layer is bonded directly to the face, and whether a built-in drainage fall is needed. Match your application to the decision table below, then verify thickness and thermal resistance with the relevant TDS and a qualified designer.
Smooth · 300 kPa

Use XPS 300 where heavy loads demand reliable thermal insulation, including foundations, floor slabs, and accessible roofs.
More detailsW (Waffle) · 300 kPa

Use XPS 300 W on accessible roofs or podium decks where load-bearing performance and maximum adhesion for membranes or coatings are critical.
More detailsSmooth · 500 kPa

Use XPS 500 where heavy static and dynamic loads demand maximum compression resistance, including industrial floors, parking decks, and road construction.
More detailsSlope · 300 kPa

Use XPS 300 SLOPE on flat roofs, terraces and green roofs where a single-layer solution must create drainage fall and provide lasting thermal insulation.
More detailsSmooth · 700 kPa

Use XPS 700 where maximum compressive strength is critical, including heavy civil infrastructure, industrial foundations, and high-load road construction projects.
More detailsX-Grip · 150 kPa

PNP XPS 150 X-Grip is a waffled-surface extruded polystyrene board engineered for superior adhesion of renders, tile adhesives and bonded ETICS systems — about 17 % lower carbon footprint than PNP XPS 300 W, lighter to handle.
More detailsValues according to the current technical data sheet.
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