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XPS 300 — Structural Foundation & Flooring Thermal Insulation

Use XPS 300 where heavy loads demand reliable thermal insulation, including foundations, floor slabs, and accessible roofs.

Compressive strength, kPa:
200–300
Declared thermal conductivity λD, W/(m·K):
0,034–0,035
Reaction to fire, class:
E
Board size (length × width), mm:
1250 × 600
Nominal thickness, mm:
20–150
Surface type:
Smooth
Edge type:
Straight edge (I) / L-shaped edge (L)

A robust rigid extruded polystyrene board engineered for thermal insulation in high-load structural applications, XPS 300 delivers exceptional compressive performance across foundations, floors, and accessible roofs. Available in thicknesses from 20 mm to 200 mm (and beyond on request), PNP XPS 300 combines consistently low thermal conductivity with outstanding mechanical strength.

Description

PNP XPS 300 is a high-performance thermal insulation material (latest generation XPS) manufactured from general-purpose polystyrene, featuring a smooth surface and a homogeneous closed-cell structure. The declared thermal conductivity (λD) is 0.034 W/m·K for thicknesses of 20–100 mm and 0.035 W/m·K for thicknesses of 120–150 mm. Compressive strength is rated CS(10\Y) 300 (≥ 300 kPa) for boards thicker than 30 mm, and CS(10\Y) 200 (≥ 200 kPa) for 20–30 mm thicknesses. Long-term water absorption by total immersion is rated WL(T) 0.7 (≤ 0.7 Vol.-%). The boards conform to EN 13164:2012+A1:2015 and are fully REACH-compliant, containing no HBCDD or other substances of very high concern.

Applications

  • Thermal insulation of foundations and foundation slabs
  • Floor and underfloor insulation in load-bearing assemblies
  • Stylobates and accessible roofs
  • Paving systems and landscaping improvement
  • Insulation beneath heavy-duty surface finishes and trafficked areas

Advantages

  • Consistently low thermal conductivity (λD 0.034–0.035 W/m·K)
  • Exceptional compressive strength — CS(10\Y) ≥ 300 kPa for boards above 30 mm
  • Virtually zero water absorption — homogeneous closed-cell structure (WL(T) ≤ 0.7 Vol.-%)
  • Absolute biostability and proven long-term durability
  • REACH-compliant and environmentally responsible — no ozone-depleting blowing agents used in production
  • Wide operating temperature range: −70 °C to +75 °C
PropertyThickness range / conditionDeclared value
Compressive strength / compressive stress at 10% deformation, CS(10\Y)20–30 mmCS(10\Y) 200 (≥200 kPa)
Compressive strength / compressive stress at 10% deformation, CS(10\Y)>30 mmCS(10\Y) 300 (≥300 kPa)
Reaction to fire, classE
Declared thermal conductivity λD, W/(m·K)20–100 mm0,034
Declared thermal conductivity λD, W/(m·K)120–150 mm0,035
Long-term water absorption by total immersion, WL(T)WL(T)0,7 (≤ 0,7 [Vol.-%])
Long-term water absorption by diffusion, WD(V)WD(V) 3 (≤ 3,0 [Vol-%])
Dimensional stability under specified conditions, DSDS(70,90)
Compressive creep, CC>30 mmCC(2/1,5/50)130
Tensile strength perpendicular to faces, TRTR 400
Freeze–thaw resistance, FTCDFTCD 1 (≤1 [Vol-%])
Thickness tolerance, classT1
Operating temperature, °C−70 … +75 °C
Deformation under specified compressive load and temperature conditionsDL T(2)5
Surface typeSmooth
Product standardEN 13164:2012+A1:2015

Values according to the current technical data sheet.

Nominal thickness, mmDeclared thermal resistance RD, m²·K/WBoards per pack, pcsPack area, m²Pack volume, m³
200,552015,000,3000
300,85139,750,2925
401,15107,500,3000
501,4586,000,3000
601,7564,500,2700
802,3553,750,3000
1002,9043,000,3000
1203,4032,250,2700
1504,2521,500,2250

Transport dimensions for boards with L-edge: 615×1265 mm

XPS 300 — Structural Foundation & Flooring Thermal Insulation

Technical data sheet

pnp_xps300-300TB_600x1250_techcard_en(20.07.2026).pdf

PDF · EN

XPS 300 — Structural Foundation & Flooring Thermal Insulation

Declaration of Performance

DoP PNP XPS 300 EMI_en (U).pdf

PDF · EN

See also

XPS 150 W X-Grip — Superior Adhesion Thermal Insulation

X-Grip · 150 kPa

XPS 150 W X-Grip — Superior Adhesion Thermal Insulation

Choose XPS 150 W X-Grip when applying heavy renders, tile adhesives, or ETICS systems to walls, basements, floors, or roofs demanding superior insulation bond strength.

XPS 300 W — High-Adhesion Structural Thermal Insulation

W (Waffle) · 300 kPa

XPS 300 W — High-Adhesion Structural Thermal Insulation

Use XPS 300 W on accessible roofs or podium decks where load-bearing performance and maximum adhesion for membranes or coatings are critical.

XPS 500 — Industrial & High Compression Thermal Insulation

Smooth · 500 kPa

XPS 500 — Industrial & High Compression Thermal Insulation

Use XPS 500 where heavy static and dynamic loads demand maximum compression resistance, including industrial floors, parking decks, and road construction.

XPS 700 — Extreme Loads & Civil Engineering Thermal Insulation

Smooth · 700 kPa

XPS 700 — Extreme Loads & Civil Engineering Thermal Insulation

Use XPS 700 where maximum compressive strength is critical, including heavy civil infrastructure, industrial foundations, and high-load road construction projects.

XPS 300 SLOPE — Tapered Roof Drainage Thermal Insulation

Slope · 300 kPa

XPS 300 SLOPE — Tapered Roof Drainage Thermal Insulation

Use XPS 300 SLOPE on flat roofs, terraces and green roofs where a single-layer solution must create drainage fall and provide lasting thermal insulation.

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