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New product

PNP XPS X-Grip developed for bonded façade systems

A lighter and more ecological XPS board with excellent adhesion properties

  • 150 kPaCompressive strength CS(10\Y)150
  • 0.033 W/(m·K)Declared thermal conductivity λD
  • ≤ 0.7 %Long-term water absorption WL(T)0,7
  • TR 400Tensile strength perpendicular to faces
  • Euroclass EReaction to fire
  • −10 %Raw material vs. PNP XPS 300 W

PNP XPS X-Grip is a new member of the PNP XPS range, produced at the Várpalota plant in Hungary. It is an extruded polystyrene board whose face is finished with the X-Grip surface: a milled and waffle-embossed texture designed to give render, tile adhesive and ETICS bonding mortars a reliable mechanical key. The board is rated CS(10\Y)150 (≥ 150 kPa), carries a declared thermal conductivity of 0.033 W/(m·K), and is classified Euroclass E for reaction to fire.

Why the surface matters in a bonded façade

In an external thermal insulation composite system (ETICS), the insulation board is glued to the wall, then covered with a reinforced base coat and a finishing render. The whole system relies on two adhesive joints, so the pull-off strength between the board face and the mortar has a direct influence on how long the façade lasts without defects.

Expanded polystyrene (EPS) is the established insulation material in Central European ETICS. XPS offers lower water absorption, a more durable board and thermal performance that does not change over time, and ETICS built with XPS boards conforming to EN 13164 have been approved by leading render-system manufacturers. The open question for XPS has always been adhesion: a smooth extrusion skin gives the mortar little to grip.

Stronger adhesion — longer lasting construction

Stronger adhesion — longer lasting construction

At a glance

  • Lighter boards less weight, less effort, better results
  • Super-adhesive surface reliable fixing adhesion and a stronger plaster system
  • Strong and reliable high-quality ETICS system for 50+ years

What X-Grip is

During the first year of production in Várpalota, PNP tested a series of surface variants for bonded applications beyond the usual solutions widely known by the market. The outcome of this innovation process is the X-Grip surface. The board face is first milled and then embossed with a waffle pattern. The mechanical key comes from this geometry alone — no chemical adhesion promoters are added to the material.

The embossing has a second effect: it re-closes the cells that milling opens on the surface. As a result, the long-term water absorption of XPS 150 X-Grip stays at the level of smooth XPS boards — WL(T)0,7, i.e. ≤ 0.7 % by volume — rather than the ≤ 3.0 % typical of milled-and-grooved boards.

Promising test results

Adhesion-strength tests were carried out at ÉMI, the Hungarian construction quality control and innovation institute, using a Mapetherm insulation-board adhesive mortar after dry storage, following EAD 040083-00-0404 with five specimens per material. Both XPS references achieved considerably higher tensile strength than the premium EPS reference. The X-Grip board reached roughly 10 % higher average adhesion strength than the premium waffled XPS reference product, and about twice the value of PNP's previous waffled surface.

Key figures

Property

XPS X-Grip

Compressive strength (EN 826)

CS(10\Y)150 — ≥ 150 kPa

Declared thermal conductivity λD

0.033 W/(m·K)

Reaction to fire

Euroclass E

Tensile strength perpendicular to faces

TR 400

Long-term water absorption

WL(T)0,7 — ≤ 0.7 Vol.-%

Dimensional stability

DS(70,90)

Board size / edge

1250 × 600 mm, straight (I) or L-edge

Thickness

40, 50, 60, 70, 80, 100 mm; TB variant 100–200 mm

Declared thermal resistance RD

1.20–3.00 m²K/W (standard); up to 6.05 m²·K/W (TB)

Service temperature

−70 °C to +75 °C

Product standard

EN 13164:2012+A1:2015

Where it fits better than common XPS solutions — and where it does not

PNP's X-Grip is intended for positions where XPS is chosen for its moisture behaviour and durability and the insulation itself does not carry large loads:

  • bonded ETICS façades with a render or tile finish;

  • plinths and base-perimeter areas, where the board acts as thermal insulation and moisture protection rather than a structural layer;

  • window and door reveals, to reduce thermal bridging and the risk of local condensation;

  • floors under a load-distributing layer in residential rooms and offices, where loads are distributed and there are no heavy racks, equipment or vehicle traffic;

  • non-accessible roofs and terraces with a load-distributing layer.

A practical rule: wherever EPS 150 would be specified, XPS X-Grip can be considered, bringing the water-absorption and durability characteristics of XPS.

It is not the right board where the design load exceeds 150 kPa, like industrial floors, vehicle-trafficked decks or road construction; where XPS 300 W, XPS 300, XPS 500 or XPS 700 apply; where a smooth face is required against waterproofing or drainage layers below ground or in inverted roofs (XPS 300, XPS 500). Confirming the load case remains the responsibility of the designer; the declared values are in the TDS and DoP.

Lighter boards — better work results

Lighter boards — better work results

At a glance

  • Lightweight convenient to carry and install
  • Quick installation time savings at every stage
  • Precision to the millimetre tight fit of boards without gaps
  • Secure fixation strong fasteners, long-lasting result

Weight, material and handling

The 150 kPa class allows a lower board density, so X-Grip uses about 10 % less raw material than PNP XPS 300 W at the same thickness. On site this means lighter boards and a lighter ETICS build-up; over the product's life it means a correspondingly lower embodied carbon per square metre. The Euroclass E fire classification is retained despite the lower density. Like all PNP XPS boards, it is REACH-compliant, contains no HBCDD or other substances of very high concern, and is produced without ozone-depleting blowing agents.

More ecological — with every board

More ecological — with every board

At a glance

  • About 10 % less raw material than XPS 300 W at the same thickness
  • Lighter façade system reduces structural demands
  • Longer lifespan, fewer renovations, less waste

Naming, availability and documents

The board is marketed as PNP XPS X-Grip. Technical data sheets and Declarations of Performance are available on the documentation page, and the product page lists the full specification. For a direct comparison with the 300 kPa waffled board, see XPS W X-Grip vs XPS 300 W. Project-specific questions are welcome: sales@pnpinsulation.com.

Planning a project with this product?

Our sales and technical team is happy to answer project-specific questions and send samples.

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