XPS 200 W - High-Bond Substrate Thermal Insulation
Features a waffled surface texture on a denser board. Designed for applications requiring exceptional adhesive tensile strength, making it the preferred substrate for heavier tiling or stone cladding systems on insulated walls.
- Length, mm:
- 1185
- Width, mm:
- 585
- Nominal thickness, mm:
- 20-150
- Surface type:
- Smooth
- Edge type:
- Straight edge (C) / L-shaped edge (T-15)
Areas of application:Balconies and loggias / Walls and facades / Roofs / Plinths / Apartments
Description
PNP XPS 150 is a highly efficient thermal insulation material (latest generation XPS) made from general-purpose polystyrene.
Applications
A universal type of thermal insulation board used in professional industrial and civil construction. Recommended for thermal insulation of basements, walls, floors, roofs, floor slabs (thermal inserts), and as a filler for expansion joints.
Advantages
- Environmental friendliness
- Safety
- Proven biostability
- Consistently low thermal conductivity
- Virtually zero water absorption (homogeneous structure of closed independent cells)
- High compressive strength
- Proven durability
Norms/standards
Production control and assessment is carried out by accredited laboratories.
Appearance/colour
Surface: smooth
Colour: orange
Packaging information
PNP XPS 150 boards are packaged in heat-shrinkable UV-stabilised film.
